LS103A ls103b ls103c 35 0m a schottky barrier diode features x small surface mounting type(quadro melf) x high reliability x low reverse curent and low forward voltage parameter symbol value units power dissipation at t amb = 25 o c p d 4 00 mw repetitive peak reverse voltage storage temperature range t stg -65 to 175 : thermal resistance( junction to ambient) r thja 300 k/w electrical characteristics @ 25 q c unless otherwise specified symbol maximum unit forward voltage i f = 2 0ma v f 0.37 v applications x low current rectification and high speed switching quadro melf suggested solder pad layout dimensions inches mm dim min max min max note a .130 .146 3.30 3.70 b .008 .016 .20 .40 c .055 .063 1.40 1.60 ? d .067 1.70 .155? .022? .065? a b cat h ode m a rk c d
omp onents 2 0736 marilla street chatsworth
mcc www. mccsemi .com revision: a 2011/01/01 tm micro commercial components 20~40volt maximum ratings* LS103A v r 40 v ls103b 30 v ls103c 20 v forward current i fm 350 ma repetitive peak forward current t p 0 s i frm 1 a i f = 2 00ma 0.60 reverse current v r = 3 0 v i r 5 ua v r = 2 0 v 5 v r = 1 0 v 5 diode capacitance v r =v f =0,f=1mhz c d 50 pf reverse recovery time i f =i r = 20ma to 0.1i r t rr 10 ns 1 of 4 LS103A ls103b ls103c epoxy meets ul 94 v-0 flammability rating moisture sensitivity level 1 ? lead free finish/rohs compliant (note1) ("p"suffix designates compliant. see ordering information) note: 1. lead in glass exemption applied, see eu directive annex 5.
characteristics (t j =25 unless otherwise specified) forward voltage: v f (v) forward current: i f (ma) forward current: i f (ma) forward voltage: v f (v) figure 1. typical variation of forward current vs. forward voltage for primary conduction through the schottky barrier figure 2. typical high current forward conduction curve t p =300ms, duty cycle=2% forward current: i f (ma) t p reverse voltage: v r reverse leakage current: i r (ua) mcc tm micro commercial components revision: a 2011/01/01 www. mccsemi .com figure 3. typical non repetitive forward surge current vs. pulse width figure 4. typical variation of reverse current at various temperatures 2 of 4
figure 5. blocking voltage duration vs. temperature at various average forward current figure 6. typical capacitance vs. reverse voltage reverse voltage: v r (v) t amb c tot (pf) reverse voltage: v r mcc tm micro commercial components revision: a 2011/01/01 www. mccsemi .com 3 of 4
mcc revision: a 2011/01/01 tm micro commercial components www. mccsemi .com 4 of 4 device packing part number-tp tape&reel: 2.5kpcs/reel ordering information : *** i m p o r t a n t n o t ic e * ** m i c r o c o m m e r c i a l c o m p on e n ts c o r p . r e s e rve s t h e r i g h t t o m a k e c h a n g e s w i t ho u t f u r t h e r no t i c e t o a n y p r o d u c t h e r e i n t o m a k e c o rr e c t i o n s , m o d i f i c a t i o n s , e n h a n c e m e n t s , i m pr o v e m e n t s , o r o t h e r ch a n g e s . m i c r o c o m m e r c i a l c o mp o n e n ts c o r p . d o e s n o t a s s u m e a n y l i a b i l i t y a r i s i n g ou t o f t h e a p p l i c a t i on o r u s e o f a n y p r o d uc t d e sc r i be d h e r e i n ; n e i t h e r d o e s i t c o n v e y a n y li c e n s e un der i t s p a t e n t r i g h t s , n o r t h e r i g h t s o f o t h e r s . t h e u s e r o f pr o d uc t s i n s u c h a p p l i c a t i o n s sh a l l a ss u m e a l l r i s k s o f su c h u s e a n d w ill a g r ee t o h o l d m i c r o c o mm er c i a l c o m p o n e n t s c o r p . a n d a ll t h e c o m p a n i e s w ho s e p r o d u c t s a r e r e p r e s e n t ed o n ou r w e b s i t e , h a r m l e s s a g a i n s t a l l d a m a g e s. * * * l i f e s u p p o r t *** m c c ' s pr o d uc t s a r e n o t a u t h o r iz ed f o r u s e a s c r i t i c a l c o m p o n e n t s i n l i f e s u pp o r t d e v i c e s o r s y s t e m s w i t h ou t t h e e x pre ss wr i tt e n a p p r o v a l o f m i c r o c o mm e r c i a l c o m p o n e n t s c o rp o r a t i o n. * * * c u s t o m e r a w a r e n e ss*** c o un t e r f e i t i n g o f s e m i c o n d u c t o r p a r t s i s a gr o w i n g p r o b l e m i n t h e i n d u s t ry . m i c r o c o mm e r c i a l c o m p o n e n t s ( m cc ) i s t a k i n g s t r o n g m e a su r e s t o p r o t e c t ou r s e l v e s a n d o u r cu s t o m e r s f r o m t h e pr o l i f e r a t i on o f c o u n t e r f e i t p a r t s . m c c s t r o n g l y e nc o u r a g e s c u s t o m e r s t o p u r c h a s e m c c p a r t s e i t h e r d i r e c t l y f r o m m c c o r f r o m a u t ho r i z e d m c c d i s t r i b u t o r s w ho a r e l i s t e d b y c o u n t r y o n o u r w e b p a g e c i t ed below . p r o d uc t s c us t o m e r s b u y e i t h e r f r o m m c c d i r e c t l y o r f r o m a u t ho r i z e d m cc d i s t r i b u t o r s a r e g e n u i n e p a r t s , h a v e f ul l t r a c e a b il i t y , m e e t m c c ' s q u a l i t y s t a n d a r d s f o r h a n d li n g a n d s t o r a g e . m c c wi l l n o t p r o v i d e a n y w a rr a n ty c o v e r a g e o r o t h e r a s s i s t a n c e f o r p a r ts b o u g h t f r o m u n a u t h o r i z e d s o u r c e s. m c c i s c o m m i t t e d t o c o m b a t t h i s g l o b a l pr o b l e m a n d e n c ou r a g e o u r c u s t o m e r s t o d o t h e i r p a r t in s t o p p i n g t h i s p r a c t i c e b y b u y i n g d i r e c t o r f r o m a u t h o r i z ed d i s t r i b u t o r s.
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